IT News & Technology update

Corsair rolls out new DDR3 memory kits for Core i5 processors

Written by IT News on 10:08 PM

Corsair, one of the world's largest suppliers of high-performance memory solutions, has recently announced the introduction of some new memory products, designed to provide support for the upcoming Intel P55 platform and next generation i5 Core and Core i7 processors. These new memory modules are available in capacities of 8 GB and 12 GB kit, which provides support for the next generation of Intel processors for desktop computers. Moreover, for better performance, the new
DHX modules are equipped with their own company and cooling technology, the new American Racing Blue fins and highlights.

"Windows 7 early adopters and advanced users require only 8 GB and 12 GB of memory solutions to optimize their computer use," said John Beekley, Vice President Technical Marketing at Corsair. "The 8 GB and 12 GB configurations, these advanced users get the most potential of high performance equipment to get, especially if they often alternate between consuming tasks such as gaming and video production. "

Fremont, California-based memory maker, the new memory kit is available in both dual-channel configurations and Triple channel, which supports all high-performance Intel platforms. Dual-channel configuration, part CMD8GX3M4A1600C8, is designed with four matched 2GB modules, optimized for the upcoming P55 motherboards, some of which have already begun to make his debut. The CMD12GX3M6A1600C8 triple-channel configuration designed with matched 2GB modules for high-end X58 platforms. Both memory kits for Intel XMP-certified profiles vault and 1600MHz speed and CAS latency settings at 8-8-8-24.

Unfortunately, the memory vendor that no information on availability and price of the new DDR3 memory kits. But we feel strongly that they will be available somewhere around the official launch of the new Intel platform.

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| Posted in » Core i5, Corsair, DDR3, Lynnfield, Memory

Super Talent rolls out new low-profile DDR3 memory module

Written by IT News on 3:47 AM

one of the world's leading suppliers of flash-based storage and DRAM memory modules, today announced the launch of its new, very low profile (VLP) DDR3-1333 Registered DIMM, specifically designed to meet and design of the current server. The new modules are targeted at servers with compact and low profile cases, with the results of the latest DDR3 memory technologies.

"We have this product for high density servers and embedded systems where space within the chassis is very limited," said Super Talent Marketing Director Joe James. "VLP modules also useful in 1U servers because of their small physique, improves airflow in the chassis."

According to the technical specifications for these new modules from Super Talent, customers will benefit from the outcome of the DDR3 memory chips on a module that is registered only 0.72 cm long, about half of what a standard DDR3 module measures. In addition, low profile design of new solutions is also a noteworthy feature that should be considered in relation to shipping and the environmental impact of the modules. Volga Super Talent, the VLP DIMM's gebruiken 40% less PCB materiaal te produce a weegt ongeveer 20% less in vergelijking met Standaard DDR3 geheugenmodules.

Like all of the company server DDR3 memory, the new VLP modules are designed with a built-in JEDEC standard thermal sensor in EEPROM, designed to measure the temperature of the module. This feature ensures that the module operates within normal parameters and gives a stable result for the server.

No word on price yet, but Super Talent the new module, part number W13VB2G8x already undertaking OEM sales force.

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| Posted in » DDR3, Memory, server memory, Super Talent, very low profile

Samsung starts mass production of the industry's first 2Gb 40nm memory chip

Written by IT News on 8:44 AM

Samsung, the world's leading innovators in advanced memory technology, recently announced that it successfully launched mass production of the first two gigabytes (GB) DDR3 devices, are designed by efficient 40nm technology class. With the announcement of the company further strengthens its position as an innovator in the memory industry as its customers with an efficient production that provides about 60 percent productivity increase in production more than previous generation 50nm process.

"We see market adoption of DDR3 in motion and courtesy of the early registration of 2Gb DDR3 with the most efficient DRAM manufacturing technology available today," said Jim Elliott, Vice President, Memory Marketing, Samsung Semiconductor, Inc. "This will show the way for a new standard for premium environmentally friendly DRAM solutions offer the most advanced, low power RDIMM for servers everywhere."

The company announced that it would use the new class 40nm chip at 16 GB, 8 GB and 4 GB RDIMMs to servers and UDIMM (unregistered in-line memory modules) for workstations and desktop computers. It will also SODIMM (small summary dual in-line memory modules) up to 4 GB for use in laptops, for customers with complete memory to offer the company's latest memory chip. According to Samsung, the new 2Gb chip is designed as energy-efficient solutions for high-density, high-performance memory and can support data speeds of 1.6 gigabits per second (Gbps) of 1.35 volts.

According to a recent report from market research firm iSuppli, 2GB DDR3 is expected to account for 82 percent of the total DDR3 DRAM market in terms of units sold in 2012. Next year, these new chips are expected to become mainstream DDR3 DRAM product, Samsung's move is a special interest, managed to be the first to mass-produce these chips.

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| Posted in » 2Gb, 40nm, DDR3, Memory, samsung

Micron validates DDR3 memory for Intel Nehalem Xeon processors

Written by IT News on 1:58 AM

Intel's highly anticipated launch of next-generation Nehalem-based Xeon 5500-series processors, a system supplier for the delivery of its latest offerings, powered by Intel's latest data. But the benefits of a high-performance server systems, users need the best and most reliable hardware solutions, including storage and warehousing. On the server's memory, Micron is a trademark as recognizable as the company continues to develop new solutions that enable higher performance. In this sense, Micron has recently announced that its collection of DDR3 memory, the server has been validated for the latest Intel Xeon processors.

"The industry has already adopted the deposition of DDR3 adoption, and we are the target for the transition to take place this year, says Michael Sporer, Director of Marketing for Micron Enterprise segment." An important catalyst in this transition is the introduction of the Intel Xeon processor platform, our server OEM customers with the ability to design an integrated, high-performance storage architecture. "

The company can now Nehalem Xeon-validated DDR3 memory modules come in 1, 2, 4 and 8-gigabyte at a rate of 1066 Mbit / s and 1333 Mbit / s. In addition, Micron also announced that its wholly-owned subsidiary, Lexar Media also has validated its decision mark DDR3 modules are now ready for use within Xeon powered server.

"Intel Xeon processor 5500 series is the most important architectural leap second since the Pentium Pro processor has almost 15 years," said Ali Sarabi, director, industry initiatives and path finding, Intel Corporation. "Micron and major suppliers are the key to memory and ecosystems, their products approved on Intel Xeon Processor 5500-series will be an important contribution for the DDR3 ramp on the market. "

Unlike Intel's latest generation of Xeon processors, the new solutions that have been developed to the memory controller on board, a feature that allows the system to improve performance through better communication between the processor and memory. These server systems are used in the growing market for cloud computing, including multiple operating systems on a computer that is sharing all resources.

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| Posted in » DDR3, Memory, Micron, nehalem, Server

AMD's Phenom II chips to gain more performance with DDR3

Written by IT News on 7:16 PM

It appears that Advanced Micro Devices' upcoming enthusiast II processors, which come with DDR3 support and AM3 socket, can increase the overall performance of your computer by almost 5 percent. This is obviously something that was expected, since most DDR3 platforms can run a little faster. Nevertheless, there are some who might consider the extremely cheap DDR2 memory modules are a better acquisition, as the performance gain is not so great overall.

On the other hand, the upcoming AM3 chipset is reported not to be too much of an over clocker. It is rumored to be able to offer the same overclocking capacity for DDR2, while the memory controller will be contained in the CPU. The problem is that they are ready to get buff II Deneb-based chips include both DDR3 and DDR2 memory controllers, which would basically mean that the processor will work with DDR3 on an AM3 chip, while stuck with DDR2 on AM2 + platform.

The buff II AM3 chips are the only ones expected to experience this issue, as the first AM2 + processors will be launched will only support DDR2. As already reported, the next generation phenom II DDR3 chips and support platforms are planned to February launch.

In related news, we learn that AMD may launch its new dual-core chips for higher-than-expected speeds. As I said earlier, the next phenom X4 II chip will contain a 3 GHz core frequency, while the future Kuma c10 65nm CPU will only beginning 2.7GHz.

According to recent news, the dual-core Regor chip, manufactured in 45nm technology, will actually sport 3 GHz or higher core speed. The higher speed may be just a rumor at the moment, but we have already seen that AMD has in store a nice range of competitive products, and the company could surprise us again.

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| Posted in » AM3, Amd, DDR3, Deneb, Phenom II

Walton Chaintech APOGEE Triple-Channel DDR3

Written by IT News on 1:51 AM

Walton Chain Tech Corporation, the leading of overclocking memory module specialist, has announced the introduction of the new APOGEE GT Triple-Channel DDR3 Memory Module Kits, specifically designed to allow users to pair them with Intel Core i7 processor and the Intel X58 Express Chipset; Mounting in recent high-end systems to date.

It is a common fact that next-generation Intel Core i7 platform can deliver a lot of performance when combined with DDR3 memory. Intel X58 chip memory controller can to increase performance and to offer greater bandwidth for the tri-channel DDR3 modules, which drove Chain Tech in the development of DDR3-1333, DDR3-1600 and DDR3-1866 triple-channel kit. According to the company, the new memory modules will be available in 3GB Kit and high capacity 6GB Kit.

Chain Tech have announced the fresh APOGEE GT Triple-Channel DDR3 Memory Module kits are developed using 8-layer PCB and memory chips by famous manufacturers, which are intended to serve as the parts with outstanding overclocking capabilities. Each of the chips have been handpicked to meet strict quality requirements, while all those manufactured using Fine-Pitch Ball Grid Array (FBGA) package is to provide better heat dissipation capability, and increased power efficiency. The memory modules can ensure the optimal performance, which combines the lower voltage requirements, higher speed, and instantaneous overclocking ability.

Walton Chain Tech has always focused on the game and overclicking market and the new APOGEE GT Triple-Channel DDR3 Memory Module kit is designed to show the long-term commitment and continuous efforts to offer the best solutions for gaming enthusiasts. The products can satisfy the needs of all users, regardless of whether the player or enthusiast, because they offer high performance and stability, which is complemented by the best possible cost.

[source softpedia.com]

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| Posted in » APOGEE GT, DDR3, Memory Module, Triple-Channel, Walton Chaintech Corporation

AMD's Phenom II chips to gain more performance with DDR3

Written by IT News on 2:34 AM

It appears that Advanced Micro Devices' upcoming enthusiast II processors, which come with DDR3 support and AM3 socket, can increase the overall performance of your computer by almost 5 percent. This is obviously something that was expected, since most DDR3 platforms can run a little faster. Nevertheless, there are some who might consider the extremely cheap DDR2 memory modules are a better acquisition, as the performance gain is not so great overall.

On the other hand, the upcoming AM3 chipset is reported not to be too much of an overclocker. It is rumored to be able to offer the same overclocking capacity for DDR2, while the memory controller will be contained in the CPU. The problem is that they are ready to get buff II Deneb-based chips include both DDR3 and DDR2 memory controllers, which would basically mean that the processor will work with DDR3 on an AM3 chip, and stuck with DDR2 in an AM2 platform .

The buff II AM3 chips are the only ones expected to experience this issue, as the first AM2 processors will be launched will only support DDR2. As already reported, the next generation phenom II DDR3 chips and support platforms are planned to February launch.

In related news, we learn that AMD may launch its new dual-core chips for higher-than-expected speeds. As I said earlier, the next phenom X4 II chip will contain a 3 GHz core frequency, while the future Kuma c10 65nm CPU will only beginning 2.7GHz.

According to recent news, the dual-core Regor chip, manufactured in 45nm technology, will actually sport 3 GHz or higher core speed. The higher speed may be just a rumor at the moment, but we have already seen that AMD has in store a nice range of competitive products, and the company could surprise us again. [softpedia.com]

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| Posted in » AM3, Amd, DDR3, Deneb, Phenom II

Apacer Brings New Products to Computex

Written by IT News on 10:28 AM

Apacer, one of the leading manufacturers of computer memory, has recently announced a new product lineup that will be unveiled at Computex in Taipei. The product will serve a wide number of users, but the company's main focus will be its entire line of DRAM modules, embedded flash solutions and digital storage.

Part of the company's new lineup of memory modules, the new Aeolus DDR3 Overclocking DRAM modules are sure to make some heads turn. These memory modules are built using the company's Aelous branded heat dissipation technology. This technology has been developed as an active dual layer overclocking memory heat spreader, meant to lower the temperatures of memory modules by more than 20 degrees Celsius. The technology will provide these high performance DDR3 memory modules with the necessary environment for a high overclocking experience.

Besides the high performance memory, Apacer is expected to release a new generation of SATA Disk Module (SDM), available with a 7-pin and 22-pin connectors. The SDMs can be placed both horizontally and vertically, which allows more room for brand new customized solutions. Apacer will be also releasing its latest Combo ATA Flash Drive, which is said to combine the high stability of an SLC with a low-cost Multi Level Cell. The new design will considerably lower the price tag of the product, compared to regular SSDs.

Other new releases include two multifunction designer flash drives, dubbed Handy Steno AH422 and Handy Steno AH161. These two products are meant to provide a stylish alternative to users looking for a portable storage solution. The company also plans to release a new MP4 player, which will go by the name of Audio Steno AU824. The media player will feature a 1.8-inch TFT-LCD screen and will be exactly 0.8 cm thick.

If you happen to find yourself at Computex, which is just around the corner (June 3-7), and want to check out Apacer's offer, the company will be located in booth J818 at the Taipei World Trade Center's Nangang Exhibition Hall.

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| Posted in » DDR2, DDR3, Hardware, News, Technology

Micron Digs For Faster DDR2, DDR3 Aspen Memory

Written by IT News on 3:17 PM

By: Bogdan Botezatu, Hardware Editor

Micron has begun shipping units of its energy-saving Aspen series of DDR2 and DDR3 memory. According to the company, memory, up to 15 per cent of the total energy absorbed by modern servers, and the figures are expected to increase as more and more memory is required for the normal operation of the server.

New memory of the victims is from Micron 1 Gigabit DDR3 modules certified to work on a 1.35V and 2 Gigabit DDR2 modules operating at 1.5V. Company achievements even below the limits established in JEDEC Council, which sets the memory of the energy needs at the level of 1.5 volts to 1.8 volts and DDR3 for DDR2 modules.

"The trend in energy-saving technologies is particularly important for data centres, as they always work - 24 hours a day, seven days a week. Until recently, IT and data center managers primarily looked at ways to reduce energy consumption in the energy-saving food processors , but they do not look at the additional savings they can achieve low-voltage memory, "said Brian Shirley, vice president of Micron Memory of the group.

According to the company, Micron will ship its energy-efficient products in the memory densities up to 4 GBs use 1 GB chips, which is supposed to use 21 percent less energy compared to the standard 1.5-volt DDR3 modules manufactured with 1 GB of memory.

In addition, the DDR2 market segment will be covered by Micron to 2 GB to 8 GB base 1.5-volt DDR2 memory modules, which have proven to reduce the power requirements to 58 per cent, compared with the standard 1.8 volts DDR2 offerings.

"Given the positive response we have received from the client Aspen Memory cards we introduced last year, we look forward to continuing our leadership in the field of energy-saving memory, providing our customers with the industry's first low-voltage DDR3, and the higher the density, low voltage DDR2 modules, "Shirley continues.

Micron is currently sampling of marine units, the low voltage DDR3 memory and DDR2 server, but the low-energy tours will enter mass production later in the fourth quarter of this year.