"We will have the CPU, called Fusion components of next generation 32nm SOI and bulk CMOS [production] we evaluate the next generation. [...] For the 32nm generation, we evaluate our options, we each generation," says Meyer, quoted in a recent news article Xbite Labs.
According to previous information on these processors, the Llano APU (Accelerated Processing Unit, or AMD CPU-GPU Fusion products call) will be designed as a solution for entry-level market, the pride of up to four Shanghai / Athlon class II nuclei, combined with DDR3 memory controller and a DirectX 11-compliant graphics chip, with third-generation Universal Video Decoder (UVD) and PCI Express 2.0 support for external graphics cards. The processor cores will be equipped with up to 4 MB of L3 cache.
Currently AMD's processors are manufactured using the SOI technology, the GPU of the company's products are manufactured using bulk technology, offered by Taiwan Semiconductor Manufacturing Company (TSMC). This means that the chip maker will be required to redesign the GPU, a GeForce 5000 class graphics chip location on the same silicon as the processor.
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